In recent years, the area array components like BGA, QFN, CSP, and flip chips, are aplicate wider and wider in the electronics manufacturing. Such as BGA, comparing with other components, it has ...
Test Research of Taiwan has revealed its latest automatic solder paste inspection machine using 3D vision, that can also inspect bumps, flux, mini LEDs and bare boards. Called TR7007Q SII it has a ...
QFN bad soldering is often happening in SMT assemble, consider from many aspects, such as pad design, PCB storage, chip control and management, solder paste management and use, furnace temperature ...
There is an increasing need for highly accurate 3D inspection and measurement capabilities for applications in SMT, semiconductor and metrology markets. 3D Multiple Reflection Suppression (MRS) sensor ...
Key Companies Covered in the 3D Solder Paste Inspection (SPI) System Market Research are MirTec Ltd, Pemtron, CyberOptics Corporation, Koh Young, PARMI Corp, Test Research, Inc (TRI), Vi TECHNOLOGY, ...
Report Ocean recently added a research report on the Solder Paste Inspection (SPI) System market. The report includes an extensive analysis of the market’s characteristics, COVID-19 impact, size and ...
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