Nowadays, there are many interconnects in IC chips. One of the packaging goals is to connect an IC to the next level of subsystem circuitry (package substrates/print circuit boards). Mass reflow (MR) ...
> Sanofi-aventis has implemented Lanner's process simulation software at a U.K. facility, following a pilot implementation that yielded $1.65 million in inventory cost savings in six months. Release ...
“Semiconductor manufacturing technology is becoming more and more rapidly. In the process of Integrated Circuit (IC) encapsulation, when wires contact each other, it will cause short circuit. Wire ...
The “composites for sustainable mobility” (CosiMo) project was launched in 2018 by Faurecia Clean Mobility (Nanterre, France) to develop a smart thermoplastic composite resin transfer molding (RTM) ...
Revamping an existing plant to increase production with minimum investment is important in today's process industries. Revamping a process plant is more complex than building a new plant. Revamps ...
The use of fiber-reinforced composites in Type 3, 4 and linerless Type 5 pressure vessels is growing, used to store compressed/renewable natural gas (CNG/RNG) and hydrogen as part of the global ...
PICATINNY ARSENAL, N.J. - Soldiers will soon be equipped with a safer and better way to store their pyrotechnic simulators-a means so effective, in fact, that it was recently named by the Department ...
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