Creating real 3D designs is proving to be much more complex and difficult than 2.5D, requiring significant innovation in both technology and tools. While there has been much discussion about 3D ...

The steady march toward 3D ICs, namely mixed-signal or multi-technology systems-on-chip (SoC) or systems-in-package (SiP), is becoming a brisk jog. With a mix of military and government funding, and ...

Various techniques for embedding 3D packaging to boost power density. Different methods for cooling chips using 3D packaging. New and emerging technologies for 3D packaging are being deployed at the ...

Full 3D designs involving logic-on-logic are still in the tire-kicking stage, but gaps in the tooling already are showing up. This is especially evident with static timing analysis (STA), which is ...

The miniaturization of electronic systems and the diffusion of components that generate a lot of heat make the role of thermal analysis more and more important as a tool to guarantee the good ...

[Carl Bugeja] has been working on his PCB motors for more than three years now, and it doesn’t seem like he is close to running out of ideas for the project. His latest creation is a tiny ...